TEATEC specializes in laser machining of various ceramic substrates. Customized service is available with quick communication to meet the demand.
． Active optical high precision.
． High stability of scribing width and depth.
． High accuracy of drilling aperture.
． Substrate surface can be further optimized after laser machining.
． Various forms of laser machining are available.
| Pulse depth | Pulse depth error | Laser point diameter | Laser point distance | Slag height |
|---|---|---|---|---|
| 0.1mm | ±0.05 mm | 0.100±0.01mm | 0.127±0.015mm |  |
| 0.2mm | 0.125±0.01mm | 0.152±0.015mm | ||
| 0.3mm | 0.145±0.01mm | |||
| 0.4mm | ±0.078 mm | 0.165±0.01mm | 0.178±0.015mm | |
| 0.5mm | 0.175±0.01mm |
| Minimum drilling aperture | Ø0.10mm |
|
| Surface Roughness | < 0.05 mm | |
| Aperture taper | D-d < 10%A | |
| Substrate thickness | 1.0mm | |
| Cut mark width | 0.100±0.015mm |
| Cross point | Laser point distance | ||
|---|---|---|---|
| Thermal Characteristics | Machining range | 100mm * 100mm |  |
| Dimension accuracy | ±0.03 mm | ||
| Hot melt zone point size | < 0.110mm (varies by depth of cut mark) | ||
| Right Angle Accuracy | 90°±20” | ||
| Laser point distance | Relative accuracy | ±0.015 mm | |
| Cumulative accuracy | ±0.015 mm | ||
| Resolution Units | 0.001mm | ||
| Double-sided cut - technique | |||
|---|---|---|---|
| Thermal Characteristics | Machining range | 100mm * 100mm |  |
| Dimension accuracy | ±0.03 mm | ||
| Right Angle Accuracy | 90°±20” | ||
| Laser point distance | Front-to-back alignment accuracy | < 0.020 mm | |
| Cumulative accuracy | ±0.015 mm | ||
| Resolution Units | 0.001mm | ||
