Product Information

  • Product
  • Aluminum Nitride Substrate
Aluminum Nitride Substrate

Alumina is of outstanding characteristics of high thermal conductivity and high electrical insulation such that It is applicable to high power electronic component application materials.

LEATEC provides various types of alumina substrates applicable to different environments, including sintering substrate, lapping substrate and polishing substrate. In addition, LEATEC also provides the alumina substrate further processing and machining service

Applicable to high power electronic component application materials.

Product Characteristics:

． High thermal conductivity (170-230 W/m． K) 7~10 times higher than alumina

． Thermal expansion coefficient close to silicon wafer

． High electrical insulation

． High mechanical strength and density

． Excellent composition stability

Product Application

． High power modules, IGBT, MOSFET,..

． High power LED packaging substrate

． Laser submount substrate

Raw Material Characteristics:

Alumina Powder

． Artificial Ceramic Material

． Strong covalent bonding

． Uniform powder grain size

． High thermal conductivity, high melting point

． High energy bandwidth 6.2eV

Aluminum nitride material characteristics:

Item Material AlN K170 AlN K200
Appearance color - Gray Gray
Density g /cm3 3.3 3.3
Thermal Characteristics Thermal conductivity W/mK 170 200
Thermal Expansion Coefficient RT ~ 300℃ (×10-6/℃) 3.77 3.77
RT ~ 500℃ (×10-6/℃) 4.38 4.38
Electrical property Dielectric Strength V/m >17 >17
Resistivity Ω•cm >1014 >1014
Dielectric Constant 1 MHz 9.9 9.9
Dielectric Loss Angle 1 MHz (×10-3) 4 4
Mechanical Characteristics Bending strength MPa 350 350



Dimension characteristics:

Item Standard Product Customized Product
Dimension  Maximum of 4.75” × 4.75” Maximum of 7.5” × 5.5”
Thickness as-fired 0.4 ~ 1.0 mm Lapped 0.15 ~ 1.0mm
Dimension Tolerance ± 1% NLT ± 1mm ± 0.05% NLT ± 0.1mm
Thickness Tolerance ± 10% ± 0.01mm
Warpage ≤ 0.003mm/mm ≤ 0.003mm/mm
Surface Roughness 0.2 ~ 0.5µm, Sintering product < 0.05µm, Polishing product

Material thermal characteristics:

Thermal conductivity VS Temperature: