LEATEC provides lapping and polishing substrates to meet customers' high precision requirements for thickness and flatness.
Through surface treatment, LEATEC can meet customers’ requirements of high precision production process for small wire diameter and wire width.
Change the thickness and surface flatness
． Thickness Tolerance ± 0.01 mm
． Flatness can reach 0.1 mm
． Thickness variation (TTV) < 0.02 mm
Lapping and polishing can be applied to...
． Automotive Pressure Sensor
． Platinum Temperature Sensor
． Wafer Growth Carrier Board
| Specification | Standard Product | Customized Product |
|---|---|---|
| Thickness Tolerance | ± 0.02mm | ± 0.015mm |
| Thickness variation (TTV) | < 20µm | < 15µm |
| Warpage | 0.003 mm/mm | 0.0025 mm/mm |
| Surface scratches | 1. Many scratches and deeper. 2. Scratch depth > 20µm. | 1. Many scratches and shallower. 2. Scratch depth 10~20µm. |
| Flatness | < 100 µm | < 80 µm |
| Specification | Standard Product |
|---|---|
| Thickness Tolerance | ± 0.02mm |
| Thickness variation (TTV) | < 10µm |
| Warpage | 0.003 mm/mm |
| Surface scratches | Visually no scratches |
| Flatness | < 80 µm |
| Surface Roughness (Ra) | 0.02 ~ 0.05 µm |
