Product Information

96 %
98 %
99.6%
Alumina Substrate

With various outstanding characteristics, alumina has been widely used in various industrial products. LEATEC provides alumina substrates of high quality characteristics.


It is applicable to high power electronic component application materials.

Alumina Substrate Characteristics:

. Excellent electrical insulation

. Resistance to acid and alkali, and resistance to corrosion

. High hardness, and high mechanical strength

. High resistance to abrasion

. Equipped with outstanding surface smoothness and high compactness

. Excellent stability under high temperature environment

. Machinable into various complicated shapes

Product Application

Alumina substrates of different purity are widely used in:

. Thick film, thin film chip resistor and resistor array substrate

. LED packaging substrate

. Hybrid integrated circuit substrate

. RF module substrate

. Copper cladding substrate

Raw Material Characteristics:

. High chemical purity

. Uniform powder grain size

. Stable α phase alumina

Material Characteristics:

Item Material 96%Al2O3 98%Al2O3 99.6%Al2O3
Appearance - White White White
Density g /cm3 >3.72 >3.74 >3.86
Average Grain Size μm 3~4 2~3 <2
Water Absorption - Nil Nil Nil
Thermal Characteristics Thermal Conductivity (25℃) W/mk 24 25 >28
Thermal Expansion Coefficient RT~300℃(×10-6/℃) 5.80 6.37 6.84
RT~500℃(×10-6/℃) 6.82 7.12 7.42
Electrical Characteristics Dielectric Strength KV/mm >15 >15 >15
Resistivity Ω•cm >1014 >1014 >1014
Dielectric Constant 1MHz 9.8 10 9.8
Dielectric Loss Angle 1MHz(×10-3) 3 3 1
Mechanical Characteristics 3-Point Bending Strength Mpa >350 >450 >600
Surface Morphology Al2O3

96% Chip Resistor Substrate:

96% Chip Resistor Model No. LEATEC Product Name Area Thickness Unit Size
L*W(mm) (mm) L*W(mm)
2512 CRM180 70.00×60.00 0.50±0.05 6.30×3.10
70.00×60.00 0.635±0.05 6.30×3.10
2010 CRM312 70.00×60.00 0.50±0.05 4.90×2.40
70.00×60.00 0.635±0.05 4.90×2.40
1812 CRM270 70.00×60.00 0.50±0.05 4.40×3.15
1218 CRM264 70.00×60.00 0.50±0.05 3.00×4.50
1210 CRM506 70.00×60.00 0.50±0.05 3.00×2.50
1206 CR0874 69.46×60.00 0.50±0.04 3.02×1.49
69.46×60.00 0.635±0.04 3.02×1.49
0612 CR0792 70.00×60.00 0.50±0.05 1.49×3.02
0805 CR1598 70.00×60.00 0.50±0.04 1.94×1.21
0603 CR3080 70.00×60.00 0.40±0.04 1.50×0.80
0402 CR7910 70.00×60.00 0.28±0.03 0.95×0.48
0201 HR7465 74.00×65.00 0.20±0.02 withoutpunch
01005 HR7060 70.00×60.00 0.10±0.01 withoutpunch
03015 HR6049 60.00×49.50 0.085±0.05 withoutpunch
HR7060 70.00×60.00 0.075±0.05 withoutpunch

※ The test values indicated in the table refer to the material general characteristics and test conditions according to relevant standard specification and sample preparation. Different production criteria and processes may be different
from such test values, and LEATEC reserves the right to make any changes to the technology.

96% Chip Array Substrate:

96% Resistor Array Model No. LEATEC Product Name Area Thickness Unit Size
L*W(mm) (mm) L*W(mm)
0603 × 4 CA504A 60×49.5 0.50±0.05 1.50×3.20
0603 × 8 CA429B 60×49.5 0.50±0.05 1.50×3.20
0402 × 4 CA1276 60×49.5 0.40±0.04 0.92×2.0

※ The test values indicated in the table refer to the material general characteristics and test conditions according to relevant standard specification and sample preparation. Different production criteria and processes may be different
from such test values, and LEATEC reserves the right to make any changes to the technology.

96% Hybrid Integrated Circuit Substrate:

LEATEC Product Name Dimension Thickness
L*W(mm) (mm)
HE4545-0308 114.3×114.3 0.2
HE4545-0010 114.3×114.3 0.25
HE4545-0015 114.3×114.3 0.38
HE4545-0025 114.3×114.3 0.635
HE4747-0310 120.65×120.65 0.25
HE4747-0315 120.65×120.65 0.38
HE4747-0316 120.65×120.65 0.4
HE4747-0320 120.65×120.65 0.5
HE4747-0325 120.65×120.65 0.635
HE4747-0332 120.65×120.65 0.8
HE4747-0340 120.65×120.65 1
HE5050-0515 127.0×127.0 0.38
HE5050-0520 127.0×127.0 0.5
HE5050-0540 127.0×127.0 1
HE7555-0015 190.5×138.0 0.38
HE7555-0025 190.5×138.0 0.635
HE7555-0040 190.5×138.0 1
HE7555-0060 190.5×138.0 1.5
HE7373-0140 185.0×185.0 1

※ The test values indicated in the table refer to the material general characteristics and test conditions according to relevant standard specification and sample preparation. Different production criteria and processes may be different
from such test values, and LEATEC reserves the right to make any changes to the technology.

98% Thin Film Resistor Substrate:

98% Thin Film Resistor Model No. LEATEC Product Name Area Thickness Unit Size
L*W(mm) (mm) L*W(mm)
2512 MCS-2512 70.00×60.00 0.50±0.05 6.30×3.10
2010 MCS-2010 70.00×60.00 0.50±0.05 4.90×2.40
1210 MCS-1210 70.00×60.00 0.50±0.05 3.00×2.50
1206 MCS-1206 70.00×60.00 0.50±0.04 3.0×1.49
0805 MCS-0805-1 70.00×60.00 0.50±0.04 1.94×1.21
0805 MCS-0805-2 70.00×60.00 0.44±0.04 1.94×1.21
0603 MCS-0603 70.00×60.00 0.40±0.04 1.50×0.80
0402 MCS-0402 70.00×60.00 0.25±0.02 0.95×0.48

※ The test values indicated in the table refer to the material general characteristics and test conditions according to relevant standard specification and sample preparation. Different production criteria and processes may be different
from such test values, and LEATEC reserves the right to make any changes to the technology.

99.6% High Purity Substrate:

Item Standard Product Customized Product
Dimension  Maximum of 4.5” * 4.5” Maximum of 5” * 5”
Thickness as-fired 0.25mm, 0.635mm Lapped 0.2 ~ 0.5mm
Dimension Tolerance ± 1% NLT ± 1mm ± 0.05% NLT ± 0.1mm
Thickness Tolerance ± 10% ± 0.01mm
Warpage ≤ 0.003mm/mm ≤ 0.003mm/mm
Surface Roughness < 0.2µm Sintering product < 0.05µm Sintering product

※ The test values indicated in the table refer to the material general characteristics and test conditions according to relevant standard specification and sample preparation. Different production criteria and processes may be different
from such test values, and LEATEC reserves the right to make any changes to the technology.